Omron G3PA Solid State Relay

Extremely Thin Relays Integrated with Heat Sinks

• Downsizing is achieved through the optimum design of the heat sink.
• Mounting is possible via screws or via DIN track.
• Close mounting is possible for linking terminals. (Except for G3PA-260B-VD and G3PA-450B-VD-2.)
• Applicable with 3-phase loads.
• Replaceable power element cartridges.
• Comply with VDE 0160 (finger protection), with a dielectric strength of 4,000 V between input and load.
• Certified by UL, CSA, and VDE (reinforced insulation).